Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388042 | Solder material and method for die attachment | Angelo Gulino, Bogdan BANKIEWICZ, Oscar Khaselev, Anna Lifton, Michael T. Marczi +2 more | 2025-08-12 |
| 11842974 | Solder material and method for die attachment | Angelo Gulino, Bogdan BANKIEWICZ, Oscar Khaselev, Anna Lifton, Michael T. Marczi +2 more | 2023-12-12 |
| 10123430 | Materials for use with interconnects of electrical devices and related methods | Michael T. Marczi, Michiel A. de Monchy, Martinus N. Finke, Brian G. Lewis | 2018-11-06 |
| 9801285 | Solder preforms and solder alloy assembly methods | Ellen S. Tormey, Girard Sidone | 2017-10-24 |