| 11384445 |
Process for electrodeposition of cobalt |
Dominique Suhr, Mikailou THIAM, Louis CAILLARD |
2022-07-12 |
| 10883185 |
Copper electrodeposition solution and process for high aspect ratio patterns |
Laurianne Religieux, Mikailou THIAM |
2021-01-05 |
| 10472726 |
Electrolyte and process for electroplating copper onto a barrier layer |
Dominique Suhr, Laurianne Religieux |
2019-11-12 |
| 9790370 |
Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kit |
Sebastien Roussel |
2017-10-17 |
| 9790371 |
Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kit |
Sebastien Roussel, Serge Palacin |
2017-10-17 |
| 9725602 |
Method for preparing an organic film at the surface of a solid support under non-electrochemical conditions, solid support thus obtained and preparation kit |
Sebastien Roussel, Serge Palacin, Guy Deniau, Thomas Berthelot, Cecile Baudin +1 more |
2017-08-08 |
| 9564333 |
Method for forming a metal silicide using a solution containing gold ions and fluorine ions |
Dominique Suhr |
2017-02-07 |
| 9368397 |
Method for forming a vertical electrical connection in a layered semiconductor structure |
Dominique Suhr |
2016-06-14 |
| 9190283 |
Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method |
Dominique Suhr |
2015-11-17 |
| 9181623 |
Solution and process for activating the surface of a semiconductor substrate |
Dominique Suhr |
2015-11-10 |
| 8883641 |
Solution and method for activating the oxidized surface of a semiconductor substrate |
Dominique Suhr |
2014-11-11 |
| 8709542 |
Method for preparing an organic film at the surface of solid support under non-electrochemical conditions, solid support thus obtained and preparation kit |
Sebastien Roussel, Serge Palacin, Guy Deniau |
2014-04-29 |
| 8524512 |
Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method |
— |
2013-09-03 |
| 8119542 |
Method of preparing an electrically insulating film and application for the metallization of vias |
Jose A. Gonzalez, Dominique Suhr |
2012-02-21 |
