Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10883185 | Copper electrodeposition solution and process for high aspect ratio patterns | Vincent Mevellec, Mikailou THIAM | 2021-01-05 |
| 10472726 | Electrolyte and process for electroplating copper onto a barrier layer | Vincent Mevellec, Dominique Suhr | 2019-11-12 |
| 10011914 | Copper electrodeposition bath containing an electrochemically inert cation | Paul Blondeau, Dominique Suhr | 2018-07-03 |