Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741501 | Systems and methods for sheathing electronic components | — | 2020-08-11 |
| 9900985 | Three-dimensional interconnect structure adapted for high frequency RF circuits | — | 2018-02-20 |
| 7911066 | Through-chip via interconnects for stacked integrated circuit structures | Eric R. Ehlers, Jim Clatterbaugh, Mathias Bonse, Jerry Orr | 2011-03-22 |
| 7309994 | Integrated directional bridge | Eric R. Ehlers, Craig Hutchinson, Richard L. Rhymes, Bobby Wong | 2007-12-18 |