Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7911066 | Through-chip via interconnects for stacked integrated circuit structures | Eric R. Ehlers, Mathias Bonse, Timothy E. Shirley, Jerry Orr | 2011-03-22 |
| 7408119 | Electrical interconnection for high-frequency devices | Xiaohui Qin, Deji Akinwande, James P. Stephens, Sr., Robin L. Zinsmaster | 2008-08-05 |
| 7295084 | Electrical interconnection for coaxial line to slab line structure including a bead ring | Hassan Tanbakuchi, Matthew Richter, Michael Whitener, Bobby Wong | 2007-11-13 |