Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8222719 | Quad flat no lead (QFN) integrated circuit (IC) package having a modified paddle and method for designing the package | Scott E. Hynes, Thomas J. Pllyer | 2012-07-17 |
| 7132735 | Integrated circuit package with lead fingers extending into a slot of a die paddle | Michael Diberardino, Xingling Zhou | 2006-11-07 |
| 7009282 | Packaged integrated circuit providing trace access to high-speed leads | — | 2006-03-07 |