Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12113044 | Semiconductor package and manufacturing method thereof | Chin-Li KAO, An-Hsuan HSU | 2024-10-08 | $2,980,000 |
| 12021169 | Composite substrate, method for manufacturing the same and method for manufacturing light-emitting device using the same | Yu-Piao Wang, Chiahao Tsai, Qin Wang, Bin Fang, Liangliang Gui +4 more | 2024-06-25 |