Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7635917 | Three-dimensional package and method of making the same | Ching-Chun Wang, Yen-Yi Wu | 2009-12-22 |
| 7250677 | Die package structure | — | 2007-07-31 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7635917 | Three-dimensional package and method of making the same | Ching-Chun Wang, Yen-Yi Wu | 2009-12-22 |
| 7250677 | Die package structure | — | 2007-07-31 |