Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032652 | Semiconductor package having improved package-on-package interconnection | Wen Tsung Hsu, Cheng-Hsien Yu, Chun Yuan Tsai, Tzung Shiou Tsai, Jia Hao Ye | 2018-07-24 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032652 | Semiconductor package having improved package-on-package interconnection | Wen Tsung Hsu, Cheng-Hsien Yu, Chun Yuan Tsai, Tzung Shiou Tsai, Jia Hao Ye | 2018-07-24 |