Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10032652 | Semiconductor package having improved package-on-package interconnection | Wen Tsung Hsu, Cheng-Hsien Yu, Tzung Shiou Tsai, Jia Hao Ye, Kuang Yi Hou | 2018-07-24 |
| 9922917 | Semiconductor package including substrates spaced by at least one electrical connecting element | Cheng-Hsien Yu, Wen Tsung Hsu | 2018-03-20 |
| 9443785 | Semiconductor package | Cheng-Hsien Yu, Wen Tsung Hsu | 2016-09-13 |