Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5684332 | Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom | C. M. Amy Chen, James Chung, Pony Maa, Simon Li | 1997-11-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5684332 | Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom | C. M. Amy Chen, James Chung, Pony Maa, Simon Li | 1997-11-04 |