Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9589906 | Semiconductor device package and method of manufacturing the same | Daesung Lee, Chulhyun Park | 2017-03-07 | $2,102,000 |
| 8178961 | Semiconductor package structure and package process | Seokbong Kim, Yuyong Lee | 2012-05-15 | $1,036,000 |