Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12482694 | Electronic package and suction device | Ching-Hua Tsai, Kuo-Shien Huang, Kuo-An Yeh | 2025-11-25 | |
| 11887865 | System and method for manufacturing a semiconductor package structure | — | 2024-01-30 | $1,104,000 |