Issued Patents All Time
Showing 26–50 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9065028 | Flip-chip light emitting diode package with moisture barrier layer | HOU-TE LIN, CHAO-HSIUNG CHANG, LUNG-HSIN CHEN | 2015-06-23 |
| 9048394 | Light emitting diode package with oxidation-resistant metal coating layer | HOU-TE LIN, CHAO-HSIUNG CHANG, LUNG-HSIN CHEN | 2015-06-02 |
| 9048408 | Light emitting diode package | HOU-TE LIN, LUNG-HSIN CHEN | 2015-06-02 |
| 9039222 | Backlight module with light-guiding portions | CHAO-HSIUNG CHANG, LI-HSIANG CHEN | 2015-05-26 |
| 9040321 | Method for manufacturing light emitting diode packages | HOU-TE LIN, LUNG-HSIN CHEN | 2015-05-26 |
| 9041022 | Light emitting diode package and method for manufacturing the same | CHE-HSANG HUANG, LUNG-HSIN CHEN, Wen-Liang Tseng, Yu-Liang Huang | 2015-05-26 |
| 9018668 | Light emitting diode package | HOU-TE LIN, LUNG-HSIN CHEN | 2015-04-28 |
| 9012248 | Method for packaging light emitting diode | LUNG-HSIN CHEN, Wen-Liang Tseng | 2015-04-21 |
| 8981447 | Light emitting diode package | HOU-TE LIN, LUNG-HSIN CHEN | 2015-03-17 |
| 8981419 | LED | HSIN-CHIANG LIN | 2015-03-17 |
| 8960955 | LED lamp having a large illumination angle | CHAO-HSIUNG CHANG, LUNG-HSIN CHEN, Wen-Liang Tseng | 2015-02-24 |
| 8945959 | LED with thin package struture and method for manufacturing the same | CHAO-HSIUNG CHANG, HSIN-CHIANG LIN | 2015-02-03 |
| 8906715 | Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the same | LUNG-HSIN CHEN, Wen-Liang Tseng | 2014-12-09 |
| 8896009 | Light emitting diode with two alternative mounting sides for mounting on circuit board | HSIN-CHIANG LIN | 2014-11-25 |
| 8883533 | Method for manufacturing light emitting diode package | HSIN-CHIANG LIN, LUNG-HSIN CHEN | 2014-11-11 |
| 8853733 | Light emitting diode package and method for manufacturing the same | CHE-HSANG HUANG, LUNG-HSIN CHEN, Wen-Liang Tseng, Yu-Liang Huang | 2014-10-07 |
| 8846422 | Method for manufacturing LED package struture and method for manufacturing LEDs using the LED packange struture | HSIN-CHIANG LIN, LUNG-HSIN CHEN | 2014-09-30 |
| 8835198 | Method for manufacturing LED | HSIN-CHIANG LIN | 2014-09-16 |
| 8791493 | Light emitting diode package and method for manufacturing the same | CHE-HSANG HUANG, LUNG-HSIN CHEN, Wen-Liang Tseng, Yu-Liang Huang | 2014-07-29 |
| 8748200 | Method for manufacturing LED package | HSIN-CHIANG LIN | 2014-06-10 |
| 8735933 | Light emitting diode package and method of manufacturing the same | HSIN-CHIANG LIN | 2014-05-27 |
| 8733115 | Method for controlling freezing capacity of a variable-frequency freezing AC ice-water system | Shyang-Yih Chen, Yu-Huan Wang, Chen-Kun Hsu, Ming-Hsien Pan, Ya-Ru Yang +1 more | 2014-05-27 |
| 8658445 | Method for manufacturing phosphor film and method for making LED package having the phosphor film | LUNG-HSIN CHEN, Wen-Liang Tseng | 2014-02-25 |
| 8633507 | LED with versatile mounting ways | HSIN-CHIANG LIN | 2014-01-21 |
| 8569791 | LED and method for manufacturing the same | HSIN-CHIANG LIN | 2013-10-29 |