Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453706 | Methods and devices for miniaturization of high density wafer based electronic 3D multi-chip modules | Keith N. Kunard | 2019-10-22 |
| 6858911 | MEMS actuators | Hirokazu Tamura, Matthew J. Neal, Alan L. Sidman | 2005-02-22 |