Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12110639 | Rail temperature expansion joint and laying and mounting method | Huihuo Wu, Zifei Guo, Fei Li, Hong Xu, Ziyong Yu +2 more | 2024-10-08 |
| 10020208 | Methods and apparatus for cleaning semiconductor wafers | Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Zhaowei Jia +2 more | 2018-07-10 |
| 9633833 | Methods and apparatus for cleaning semiconductor wafers | Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Zhaowei Jia +3 more | 2017-04-25 |
| 9595457 | Methods and apparatus for cleaning semiconductor wafers | Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Zhaowei Jia +2 more | 2017-03-14 |
| 9492852 | Methods and apparatus for cleaning semiconductor wafers | Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Zhaowei Jia +3 more | 2016-11-15 |