Issued Patents All Time
Showing 76–90 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8033444 | Explosion welding with a mold and copper layer | Yaohua Wang | 2011-10-11 |
| 7384808 | Fabrication method of high-brightness light emitting diode having reflective layer | Jin-Hsiang Liu, Kun-Chuan Lin | 2008-06-10 |
| 7335924 | High-brightness light emitting diode having reflective layer | Jin-Hsiang Liu, Kun-Chuan Lin | 2008-02-26 |
| 7136173 | Method and apparatus for end-point detection | — | 2006-11-14 |
| 7119008 | Integrating metal layers with ultra low-K dielectrics | — | 2006-10-10 |
| 6837984 | Methods and apparatus for electropolishing metal interconnections on semiconductor devices | — | 2005-01-04 |
| 6749728 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces | — | 2004-06-15 |
| 6726823 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces | Felix Gutman, Voha Nuch | 2004-04-27 |
| 6638863 | Electropolishing metal layers on wafers having trenches or vias with dummy structures | Peihaur Yih | 2003-10-28 |
| 6495007 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces | — | 2002-12-17 |
| 6447668 | Methods and apparatus for end-point detection | — | 2002-09-10 |
| 6440295 | Method for electropolishing metal on semiconductor devices | — | 2002-08-27 |
| 6395152 | Methods and apparatus for electropolishing metal interconnections on semiconductor devices | — | 2002-05-28 |
| 6391166 | Plating apparatus and method | — | 2002-05-21 |
| 6248222 | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces | — | 2001-06-19 |