Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404386 | Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods | Brett A. Beiermann, John C. Clark, Eric G. Larson, Audrey S. Forticaux, Jay R. Lomeda +5 more | 2025-09-02 |
| 11773254 | Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods | Brett A. Beiermann, John C. Clark, Eric G. Larson, Audrey S. Forticaux, Jay R. Lomeda +5 more | 2023-10-03 |
| 11472992 | Polymer matrix composites comprising thermally conductive particles and methods of making the same | Derek J. Dehn, Clinton P. Waller, Jr., Bharat R. Acharya, Brandon A. Bartling, Audrey S. Forticaux +1 more | 2022-10-18 |
| 10899865 | Bisphenol M diphthalonitrile ether resin blends including a filler, and articles | Benjamin J. Anderson, Jay R. Lomeda, Wendy L. Thompson, Amit J. Patel | 2021-01-26 |
| 10087352 | Oriented thermally conductive dielectric film | Mario A. Perez, Mitchell T. Huang, Clint J. Novotny | 2018-10-02 |
| 9834713 | Oriented thermally conductive dielectric film | Mario A. Perez, Mitchell T. Huang, Clint J. Novotny | 2017-12-05 |