Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404386 | Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods | Brett A. Beiermann, John C. Clark, Eric G. Larson, Jeremy M. Higgins, Jay R. Lomeda +5 more | 2025-09-02 |
| 11773254 | Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods | Brett A. Beiermann, John C. Clark, Eric G. Larson, Jeremy M. Higgins, Jay R. Lomeda +5 more | 2023-10-03 |
| 11472992 | Polymer matrix composites comprising thermally conductive particles and methods of making the same | Derek J. Dehn, Clinton P. Waller, Jr., Bharat R. Acharya, Brandon A. Bartling, Jeremy M. Higgins +1 more | 2022-10-18 |
| 11168193 | Foams and methods of making | Joshua M. Fishman, Caitlin E. Meree, Ying Lin, Qin Lin, Carla S. Thomas +2 more | 2021-11-09 |