Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394768 | Package structure | Jia-Tay Kuo, Chiao Fu, Sheng-Bo Wang, Chen-Yu Wang | 2025-08-19 |
| D1059315 | Package structure for a semiconductor element | Jia-Tay Kuo, Chen-Yu Wang, Sheng-Bo Wang, Chiao Fu | 2025-01-28 |