CW

Chen-Yu Wang

Huawei: 3 patents #441 of 3,894Top 15%
CT Chipbond Technology: 2 patents #1 of 21Top 5%
UC University of Colorado, A Body Corporate: 1 patents #25 of 181Top 15%
Overall (2025): #10,075 of 469,880Top 3%
8
Patents 2025

Issued Patents 2025

Patent #TitleCo-InventorsDate
12394768 Package structure Jia-Tay Kuo, Chiao Fu, Sheng-Bo Wang, Yao-Zhong Liu 2025-08-19
12317462 Electronic package and method of manufacturing the same Pai-Sheng Cheng, Huan-Kuen Chen 2025-05-27
12242747 Data deduplication method and apparatus, and computer program product Ren Ren, Haijun Dai, Fangfang Zhu 2025-03-04
12223171 Metadata processing method to improve data read/write efficiency of a storage device Meng Gao, Wenlin Cui, Siwei Luo, Ren Ren 2025-02-11
12224183 Method of manufacturing semiconductor device Shrane-Ning Jenq, Wen-Cheng Hsu, Chih-Ming Kuo, Chwan-Tyaw Chen, Lung-Hua Ho 2025-02-11
12216928 Fragment management method and fragment management apparatus Tangren Yao, Feng Wang 2025-02-04
D1059315 Package structure for a semiconductor element Jia-Tay Kuo, Sheng-Bo Wang, Chiao Fu, Yao-Zhong Liu 2025-01-28
12187851 Network polymers and methods of making and using same Christopher N. Bowman, Brady T. Worrell, Gayla Lyon, Matthew K. McBride 2025-01-07