Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412795 | Dual down-set conductive terminals for externally mounted passive components | — | 2025-09-09 |
| 12334417 | Leaded semiconductor device package having leads with different widths | — | 2025-06-17 |
| 12272626 | Conductive members atop semiconductor packages | Makoto Shibuya, Kengo Aoya, Anindya Poddar | 2025-04-08 |
| 12259445 | Hall sensor using face down structure with through substrate vias | Daiki Komatsu | 2025-03-25 |