Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272626 | Conductive members atop semiconductor packages | Masamitsu Matsuura, Kengo Aoya, Anindya Poddar | 2025-04-08 |
| 12230539 | Wafer chip scale packaging with ball attach before repassivation | Daiki Komatsu | 2025-02-18 |