Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218041 | Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods | Jihong Choi, Giridhar Nallapati, Jianwen Xu, Jonghae Kim, Periannan Chidambaram +1 more | 2025-02-04 |