| 12424518 |
Capacitor embedded 3D resonator for broadband filter |
Je-Hsiung Lan, Kai Liu, Ranadeep Dutta |
2025-09-23 |
| 12400966 |
Package comprising integrated devices and bridge coupling top sides of integrated devices |
Bharani Chava, Abinash ROY, Stanley Seungchul Song |
2025-08-26 |
| 12395152 |
Compact hybrid acoustic wave filter structure |
Je-Hsiung Lan, Nosun PARK, Jui-Yi Chiu, Kai Liu |
2025-08-19 |
| 12354948 |
Integrated device and integrated passive device comprising magnetic material |
Kai Liu, Roy Chiu, Nosun PARK, Je-Hsiung Lan |
2025-07-08 |
| 12334903 |
Substrate comprising acoustic resonators configured as at least one acoustic filter |
Je-Hsiung Lan, Ranadeep Dutta |
2025-06-17 |
| 12300655 |
Integrated circuit assembly with hybrid bonding |
Milind Shah, Periannan Chidambaram, Abdolreza Langari |
2025-05-13 |
| 12283607 |
3D inductor design using bundle substrate vias |
Je-Hsiung Lan, Ranadeep Dutta |
2025-04-22 |
| 12273095 |
Wideband filter with resonators and inductors |
Kai Liu, Rui Tang, Changhan Hobie Yun, Mario Francisco Velez |
2025-04-08 |
| 12253885 |
Electronic device including flexible display |
Joungmin CHO, Sungdae CHOI, Kwangtai KIM, Donghyun YEOM |
2025-03-18 |
| 12255381 |
Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods |
Ranadeep Dutta, Je-Hsiung Lan |
2025-03-18 |
| 12218041 |
Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods |
Jihong Choi, Giridhar Nallapati, William Stone, Jianwen Xu, Periannan Chidambaram +1 more |
2025-02-04 |
| 12206155 |
Radio frequency oscillator with ceramic resonator and surface-mounted integrated circuit package |
Kai Liu, Jui-Yi Chiu, Nosun PARK, Je-Hsiung Lan |
2025-01-21 |
