Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237293 | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof | Hiroyuki Amano, Takeshi Kuwahara, Tsukasa ICHIKAWA, Osamu Matsuzawa, Wei CHEN | 2025-02-25 |