Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237293 | Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof | Hiroyuki Amano, Yuki Antoku, Takeshi Kuwahara, Tsukasa ICHIKAWA, Osamu Matsuzawa | 2025-02-25 |
| 12224328 | Semiconductor device having word line structure | Cheng Ji | 2025-02-11 |