Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347717 | Debonding structures for wafer bonding | Wei-Ting Yeh, De-Yang Chiou, Yu-Yun Peng, Keng-Chu Lin | 2025-07-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347717 | Debonding structures for wafer bonding | Wei-Ting Yeh, De-Yang Chiou, Yu-Yun Peng, Keng-Chu Lin | 2025-07-01 |