Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334475 | 3D trench capacitor for integrated passive devices | Chung-Yi Yu, Yeong-Jyh Lin, Rei-Lin Chu | 2025-06-17 |
| 12289979 | Deposition system for high accuracy patterning | Ping-Yin Liu, Chia-Shiung Tsai, Yu-Hsing Chang, Yeong-Jyh Lin | 2025-04-29 |
| 12255062 | Integrate rinse module in hybrid bonding platform | Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao +2 more | 2025-03-18 |
| 12211727 | Simultaneous bonding approach for high quality wafer stacking | Ping-Yin Liu, Chang-Chen Tsao | 2025-01-28 |
| 12195017 | Redundant electronic control system and device | Xuefeng Chen, Zhimin Zhang | 2025-01-14 |