Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
MC

Ming-Yen Chiu

TSMC: 1 patents #2,025 of 3,957Top 55%
📍 Zhubeikou, TW: #122 of 275 inventorsTop 45%
Overall (2025): #281,997 of 469,880Top 65%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12334406 Package with tilted interface between device die and encapsulating material Hsin-Chieh Huang, Ching Fu Chang 2025-06-17