Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334406 | Package with tilted interface between device die and encapsulating material | Ming-Yen Chiu, Hsin-Chieh Huang | 2025-06-17 |
| 12261074 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2025-03-25 |