Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354907 | Electron migration control in interconnect structures | Chun-Jen Chen, Kai-Shiung Hsu, Ding-I Liu | 2025-07-08 |
| 12354908 | Amorphous layers for reducing copper diffusion and method forming same | Chia-Yu Wu, Kai-Shiung Hsu, Ding-I Liu | 2025-07-08 |