Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354908 | Amorphous layers for reducing copper diffusion and method forming same | Jyh-Nan Lin, Kai-Shiung Hsu, Ding-I Liu | 2025-07-08 |
CW
Chia-Yu Wu
Overall (2025): #420,542 of 469,880Top 90%
1
Patents 2025