Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414380 | Method for forming an integrated chip (IC) including forming a through substrate via (TSV) in an isolation structure formed in a first opening that formed in a metal substrate layer | Harry-Hak-Lay Chuang, Chien-Hung Liu | 2025-09-09 |
| 12408439 | Integrated chip (IC) having conductive TSV extended through SOI substrate comprising a semiconductor device layer, an insulating layer and a metal layer | Harry-Hak-Lay Chuang, Chien-Hung Liu | 2025-09-02 |
| 12364020 | Diode with reduced current leakage | Shiang-Hung Huang, Tsung-Hao Yeh | 2025-07-15 |
| 12300566 | Integrated chip with good thermal dissipation performance | Harry-Hak-Lay Chuang, Shiang-Hung Huang, Tsung-Hao Yeh | 2025-05-13 |
| 12218189 | Semiconductor device and method for manufacturing the same | Tsung-Hao Yeh, Chih-Wei Hung | 2025-02-04 |