Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308303 | Integrated circuit die with memory macro including through-silicon via and method of forming the same | Hidehiro Fujiwara, Tze-Chiang Huang, Yen-Huei Chen, Hung-Jen Liao, Jonathan Tsung-Yung Chang +2 more | 2025-05-20 |