Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283568 | Wafer bonding alignment | Hsi-Cheng Hsu, Jui-Chun Weng, Ji-Hong Chiang, Kuo-Hao Lee, Chia-Yu Lin +4 more | 2025-04-22 |
| 12271006 | Multifunctional collimator for contact image sensors | Hsin-Yu Chen, Yen-Chiang Liu, Jiun-Jie Chiou, Jia-Syuan Li, You-Cheng Jhang +9 more | 2025-04-08 |