Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
CL

Chia-Yu Lin

TSMC: 1 patents #2,025 of 3,957Top 55%
Overall (2025): #425,212 of 469,880Top 95%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12283568 Wafer bonding alignment Hsi-Cheng Hsu, Jui-Chun Weng, Ching-Hsiang Hu, Ji-Hong Chiang, Kuo-Hao Lee +4 more 2025-04-22