Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414232 | Substrate structure | Pei-Geng Weng, Fang-Lin Tsai, Wei-Son TSAI | 2025-09-09 |
| 12255182 | Electronic package and manufacturing method thereof | Meng-Huan Chia, Chang-Fu Lin, Don-Son Jiang | 2025-03-18 |