Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414232 | Substrate structure | Pei-Geng Weng, Wei-Son TSAI, Yih-Jenn Jiang | 2025-09-09 |
| 12334452 | Electronic package and manufacturing method thereof | Chao Pu, Chi-Ching Ho, Yi-Min Fu, Yu-Po Wang | 2025-06-17 |