Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388062 | Electronic package and manufacturing method thereof | Chih-Hsien Chiu, Chin-Chiang He, Ko-Wei Chang, Chien-Cheng Lin | 2025-08-12 |
| 12224255 | Electronic package including lead frame having multiple conductive posts | Chih-Hsien Chiu | 2025-02-11 |
| 12211776 | Electronic package and manufacturing method thereof | Chih-Hsien Chiu, Ko-Wei Chang, Che-Wei Yu, Chia-Yang Chen | 2025-01-28 |