Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388062 | Electronic package and manufacturing method thereof | Wen-Jung Tsai, Chin-Chiang He, Ko-Wei Chang, Chien-Cheng Lin | 2025-08-12 |
| 12230590 | Electronic package and manufacturing method thereof | Ko-Wei Chang | 2025-02-18 |
| 12224255 | Electronic package including lead frame having multiple conductive posts | Wen-Jung Tsai | 2025-02-11 |
| 12211776 | Electronic package and manufacturing method thereof | Ko-Wei Chang, Wen-Jung Tsai, Che-Wei Yu, Chia-Yang Chen | 2025-01-28 |