Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
YS

Yoshikatsu Shiraokawa

RE Resonac: 1 patents #53 of 218Top 25%
Overall (2025): #159,266 of 469,880Top 35%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12363826 Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate Shinichi Kamoshida, Hiroshi Kurokawa 2025-07-15