Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12363826 | Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate | Yoshikatsu Shiraokawa, Hiroshi Kurokawa | 2025-07-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12363826 | Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate | Yoshikatsu Shiraokawa, Hiroshi Kurokawa | 2025-07-15 |