Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12421435 | Adhesive composition for flexible printed-wiring board (FPC), and heat-curable resin film, prepreg and FPC substrate containing same | Atsushi TSUURA, Hiroyuki IGUCHI, Yuki Kudo, Masayuki Iwasaki, Rina SASAHARA | 2025-09-23 |
| 12264270 | Method for producing cured product of heat-curable maleimide resin composition | — | 2025-04-01 |