Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12421435 | Adhesive composition for flexible printed-wiring board (FPC), and heat-curable resin film, prepreg and FPC substrate containing same | Atsushi TSUURA, Yoshihiro TSUTSUMI, Yuki Kudo, Masayuki Iwasaki, Rina SASAHARA | 2025-09-23 |