Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12342467 | Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component | Hideo Nakagawa, Yoshinori Ogawa, Nobuaki Matsumoto, Shuhei Ueda, Kohei Otake | 2025-06-24 |