Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12342467 | Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component | Hideo Nakagawa, Nobuaki Matsumoto, Shuhei Ueda, Keiji Ohori, Kohei Otake | 2025-06-24 |
| D1070795 | Stamp component for transferring microstructure | Kazunori Kondo, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi KITAGAWA | 2025-04-15 |
| D1070796 | Stamp component for transferring microstructure | Kazunori Kondo, Nobuaki Tomura, Nobuaki Matsumoto, Akira Sakamoto, Taichi KITAGAWA | 2025-04-15 |