Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12235316 | Chip moving device | Jianjun Huang, Yonghong Wu, Shan ZHAO, Haiyang Hu | 2025-02-25 |
| 12237184 | Heating structure and wafer test device | Bin Zhou, Xiaoming Guo, Pengsong Xu | 2025-02-25 |
| 12228603 | Wafer-level semiconductor high-voltage reliability test fixture | Pengsong Xu, Jianjun Huang, Haiyang Hu | 2025-02-18 |
| 12216139 | Adaptive flexible chip test socket and formation method thereof | Jianjun Huang, Yonghong Wu, Shan ZHAO, Haiyang Hu | 2025-02-04 |
| 12216156 | Chip test pressing-down apparatus and formation method thereof | Jianjun Huang, Yonghong Wu, Shan ZHAO, Haiyang Hu | 2025-02-04 |