Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12351684 | Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board | Hiroyuki Matsuyama, Yoshihiko Konno | 2025-07-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12351684 | Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board | Hiroyuki Matsuyama, Yoshihiko Konno | 2025-07-08 |