Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
HM

Hiroyuki Matsuyama

AC Arisawa Mfg. Co.: 1 patents #1 of 3Top 35%
Overall (2025): #369,069 of 469,880Top 80%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12351684 Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board Yoshinori Sato, Yoshihiko Konno 2025-07-08